18923764396
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2063623-2

Part number 2063623-2
Product classification Crimp Heads, Die Sets
Manufacturer TE Application Tooling
Description SDE F MCP2.8 0.35MM2 DIE SET
Encapsulation
Packing Box
Quantity 2
RoHS status NO
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Inventory:
Total number

Quantity

Price

Total price

1

$618.8070

$618.8070

5

$598.1745

$2,990.8725

10

$577.5525

$5,775.5250

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Product parameters
PDF(1)
TYPEDESCRIPTION
MfrTE Application Tooling
SeriesSDE-SA, MCP
PackageBox
Product StatusACTIVE
For Use With/Related Products967715
Tool TypeDie Set
Compatible Tools9-1478240-0

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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