18923764396
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2386893-2

Part number 2386893-2
Product classification Crimp Heads, Die Sets
Manufacturer TE Application Tooling
Description SDE F SYSTEM CONTACT 0.50-1.00 D
Encapsulation
Packing Box
Quantity 2
RoHS status YES
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Total number

Quantity

Price

Total price

1

$730.1490

$730.1490

5

$705.8205

$3,529.1025

10

$681.4815

$6,814.8150

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Product parameters
PDF(1)
TYPEDESCRIPTION
MfrTE Application Tooling
SeriesSDE-SA
PackageBox
Product StatusACTIVE
For Use With/Related Products927785, 927797
Tool TypeDie Set
Compatible Tools9-1478240-0

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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