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A18145-02

Part number A18145-02
Product classification Pads, Sheets
Manufacturer Laird Technologies - Thermal Materials
Description THERM PAD 228.6MMX228.6MM GRAY
Encapsulation
Packing Bulk
Quantity 73
RoHS status YES
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Total number

Quantity

Price

Total price

1

$17.1990

$17.1990

10

$16.2435

$162.4350

100

$13.3770

$1,337.7000

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Product parameters
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TYPEDESCRIPTION
MfrLaird Technologies - Thermal Materials
SeriesTflex™ RB300
PackageBulk
Product StatusACTIVE
ColorGray
MaterialSilicone, Ceramic Filled
ShapeSquare
Thickness0.0200" (0.508mm)
TypeGap Filler Pad, Sheet
Outline228.60mm x 228.60mm
Thermal Conductivity1.2W/m-K
AdhesiveTacky - Both Sides

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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