18923764396
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AGIB027R29A2I1V

Part number AGIB027R29A2I1V
Product classification System On Chip (SoC)
Manufacturer Intel
Description IC
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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$48,354.9150

$145,064.7450

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Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex I
PackageTray
Product StatusACTIVE
Package / Case2957-BFBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Number of I/O720
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 2.7M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package2957-BGA (56x45)
ArchitectureMPU, FPGA
Alternative models
AGIB027R29A2I1V
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AGIB027R29A2I1VB
英特尔-Intel
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Similar models
AGIB027R29A2I1VC
英特尔-Intel
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AGIB027R29A2I1V
英特尔-Intel
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Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
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MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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