18923764396
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DB3-AP

Part number DB3-AP
Product classification DIACs, SIDACs
Manufacturer Micro Commercial Components (MCC)
Description DIAC BIDIRECTIONAL DO-35G
Encapsulation
Packing Tape & Box (TB)
Quantity 0
RoHS status YES
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TYPEDESCRIPTION
MfrMicro Commercial Components (MCC)
Series-
PackageTape & Box (TB)
Product StatusOBSOLETE
Package / CaseDO-204AH, DO-35, Axial
Operating Temperature-40°C ~ 110°C (TJ)
Voltage - Breakover28 ~ 36V
Current - Breakover100 µA
Supplier Device PackageDO-35G
Current - Peak Output2 A

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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18923764396

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