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EM032LXQAB313ES1T

Part number EM032LXQAB313ES1T
Product classification Memory
Manufacturer Everspin Technologies, Inc.
Description MRAM
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
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960

$31.8990

$30,623.0400

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Product parameters
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TYPEDESCRIPTION
MfrEverspin Technologies, Inc.
SeriesEMxxLX
PackageTray
Product StatusACTIVE
Package / Case24-TBGA
Mounting TypeSurface Mount
Memory Size32Mbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)
Voltage - Supply1.65V ~ 2V
TechnologyMRAM (Magnetoresistive RAM)
Clock Frequency200 MHz
Memory FormatRAM
Supplier Device Package24-TBGA (6x8)
Memory InterfaceSPI - Octal I/O
Access Time7 ns
Memory Organization4M x 8

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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