18923764396
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FORLINX-FETMX8MM-C+182GSE8GCA10

Part number FORLINX-FETMX8MM-C+182GSE8GCA10
Product classification Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Forlinx Embedded
Description NXP i.MX8M MiniSOM,2G DDR4,8GB e
Encapsulation
Packing Tape & Box (TB)
Quantity 1
RoHS status YES
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$68.2500

$68.2500

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TYPEDESCRIPTION
MfrForlinx Embedded
Series-
PackageTape & Box (TB)
Product StatusACTIVE
Connector TypeBoard-to-Board (BTB) Socket - 240
Size / Dimension2.200" L x 1.417" W (56.00mm x 36.00mm)
Speed1.8GHz
RAM Size2GB
Operating Temperature0°C ~ 70°C
Module/Board TypeMPU
Core ProcessorARM Cortex-A53, ARM® Cortex®-M4F
Flash Size8GB eMMC

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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