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GD55X01GEB2RY

Part number GD55X01GEB2RY
Product classification Memory
Manufacturer GigaDevice
Description LINEAR IC
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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4800

$19.9395

$95,709.6000

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Product parameters
TYPEDESCRIPTION
MfrGigaDevice
SeriesGD55X
PackageTray
Product StatusACTIVE
Package / Case24-TBGA
Mounting TypeSurface Mount
Memory Size1Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C (TA)
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NOR (SLC)
Clock Frequency200 MHz
Memory FormatFLASH
Supplier Device Package24-TFBGA (6x8)
Memory InterfaceSPI - Octal I/O, DTR
Memory Organization128M x 8

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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