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PAD3U

Part number PAD3U
Product classification Prototype Boards Perforated
Manufacturer BusBoard Prototype Systems
Description PADBOARD-3U PAD-PER-HOLE, DOUBLE
Encapsulation
Packing Bag
Quantity 41
RoHS status YES
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$14.3325

$14.3325

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TYPEDESCRIPTION
MfrBusBoard Prototype Systems
Series-
PackageBag
Product StatusACTIVE
Size / Dimension6.30" L x 3.94" W (160.02mm x 100.08mm)
MaterialFR4 Epoxy Glass
Pitch0.1" (2.54mm) Grid
Board Thickness0.063" (1.60mm)
Proto Board TypeBreadboard, General Purpose
Hole Diameter0.037" (0.94mm)
Circuit PatternCommon Bus
PlatingPlated Through Hole (PTH)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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