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311

零件编号 311
产品分类 穿孔原型板
制造商 Serpac Electronic Enclosures
描述 BREADBRD PREPUNCHED INSULAT NPTH
封装
包装 散装
数量 0
RoHS 状态 YES
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产品参数
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类型描述
制造商Serpac Electronic Enclosures
系列-
包装散装
产品状态OBSOLETE
尺寸/尺寸1.76" L x 1.28" W (44.7mm x 32.5mm)
沥青0.100" (2.54mm)
板厚0.062" (1.58mm)
原型板类型Breadboard, Prepunched Insulating
孔径0.038" (0.97mm)
电镀Non-Plated Through Hole (NPTH)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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