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A-WBP-L006EG-08SR01

零件编号 A-WBP-L006EG-08SR01
产品分类 接头、公引脚
制造商 ASSMANN WSW Components
描述 WIRE-TO-BOARD, WAFER, 2.50MM, 8P
封装
包装 卷带式 (TR)
数量 0
RoHS 状态 YES
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库存:
总数

数量

价格

总价

2400

$0.9135

$2,192.4000

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产品参数
PDF(1)
类型描述
制造商ASSMANN WSW Components
系列A-WBP
包裹卷带式 (TR)
产品状态ACTIVE
特征Pick and Place, Solder Retention
连接器类型Header
额定电压250VAC/DC
额定电流(安培)3A
安装类型Surface Mount
职位数量8
行数1
风格Board to Cable/Wire
工作温度-25°C ~ 85°C
触点类型Male Pin
紧固类型Detent Lock
已加载职位数All
终止Solder
接触材料Brass
绝缘颜色Natural
间距 - 交配0.098" (2.50mm)
接触面完成 - 配合Tin
联系完成 - 后Tin
触点形状Square
绝缘高度0.311" (7.90mm)
笼罩Shrouded - 4 Wall
绝缘材料Liquid Crystal Polymer (LCP)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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