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RP605Z363B-E2-F

零件编号 RP605Z363B-E2-F
产品分类 电源管理 - 专业
制造商 RICOH/Nisshinbo Micro Devices
描述 300MA ULTRA-LOW POWER BUCK BOOST
封装
包装 卷带式 (TR)
数量 4250
RoHS 状态 YES
分享
库存:
总数

数量

价格

总价

1

$2.5305

$2.5305

10

$2.2785

$22.7850

25

$2.1525

$53.8125

100

$1.8270

$182.7000

250

$1.7220

$430.5000

500

$1.5015

$750.7500

1000

$1.2495

$1,249.5000

2500

$1.1550

$2,887.5000

5000

$1.1130

$5,565.0000

获取报价信息
产品参数
PDF(1)
类型描述
制造商RICOH/Nisshinbo Micro Devices
系列RP605x
包装卷带式 (TR)
产品状态ACTIVE
包装/箱20-XFBGA, WLCSP
安装类型Surface Mount
工作温度-40°C ~ 85°C (TA)
电压 - 电源1.8V ~ 5.5V
应用领域Battery Management, Power Supplies
供电300nA
供应商设备包20-WLCSP-P3 (2.32x1.71)

Panasonic Electronic Components
RES SMD 1.1K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 2.4K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 1.5K OHM 5% 1/8W 0805
Panasonic Electronic Components
RES SMD 3K OHM 5% 1/8W 0805
Roving Networks (Microchip Technology)
IC EEPROM 1KBIT MICROWIRE 8SOIC
Omron Electronic Components
SENSOR OPT REFLECTIVE 5MM 5DIP
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 1POS
Sullins Connector Solutions
CONN HEADER VERT 2POS
Sullins Connector Solutions
CONN HEADER R/A 2POS
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