18923764396
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SBB830-QTY25

零件编号 SBB830-QTY25
产品分类 穿孔原型板
制造商 Chip Quik, Inc.
描述 830 PTS SOLDER-IN BREADBOARD (EX
封装
包装 散装
数量 0
RoHS 状态 YES
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总数

数量

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$82.7295

$82.7295

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产品参数
类型描述
制造商Chip Quik, Inc.
系列Proto-Advantage
包装散装
产品状态ACTIVE
尺寸/尺寸6.60" L x 2.30" W (167.6mm x 58.4mm)
材料FR4 Epoxy Glass
沥青0.1" (2.54mm) Grid
板厚0.063" (1.60mm)
原型板类型Breadboard, General Purpose
孔径0.039" (1.00mm)
电路图案5 Hole Pad (Single Side)
电镀Plated Through Hole (PTH)
相似型号
HSBB8008
华朔-HUASHUO
MOSFET

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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