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TSE2004GB2B0NCG8/M

零件编号 TSE2004GB2B0NCG8/M
产品分类 热管理
制造商 Intersil (Renesas Electronics Corporation)
描述 TEMPERATURE SENSOR
封装
包装 散装
数量 0
RoHS 状态 NO
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产品参数
PDF(1)
类型描述
制造商Intersil (Renesas Electronics Corporation)
系列-
包装散装
产品状态OBSOLETE
包装/箱8-WFDFN Exposed Pad
输出类型I2C/SMBus
安装类型Surface Mount
功能Temp Monitoring System (Sensor)
准确性±2°C
工作温度-40°C ~ 125°C
电压 - 电源2.2V ~ 3.6V
传感器类型Internal
拓扑结构ADC (Sigma Delta), Control Logic, Register Bank
输出报警No
输出风扇No
供应商设备包8-VFQFPN (2x3)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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