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ZSSC3123AI6C

零件编号 ZSSC3123AI6C
产品分类 传感器和检测器接口
制造商 Intersil (Renesas Electronics Corporation)
描述 DICE (WAFER SAWN) - FRAME
封装
包装 托盘
数量 0
RoHS 状态 YES
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库存:
总数

数量

价格

总价

9464

$1.7640

$16,694.4960

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产品参数
PDF(1)
类型描述
制造商Intersil (Renesas Electronics Corporation)
系列cLite™
包装托盘
产品状态ACTIVE
包装/箱Die
输出类型I2C, SPI
安装类型Surface Mount
类型Capacitive Sensor
工作温度-40°C ~ 85°C (TA)
输入类型Capacitive
供应商设备包Die
供电1.1 mA

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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