18923764396
取消

27-121-015-0000

零件编号 27-121-015-0000
产品分类 RFI 和 EMI - 触点、指接件和垫片
制造商 Jones Tech
描述 RFI COND FOAM PU NICKEL ADH
封装
包装 盒子
数量 50
RoHS 状态 YES
分享
库存:
总数

数量

价格

总价

1

$8.0745

$8.0745

10

$7.6125

$76.1250

50

$6.6675

$333.3750

获取报价信息
产品参数
PDF(1)
PDF(2)
类型描述
制造商Jones Tech
系列-
包装盒子
产品状态ACTIVE
材料Polyurethane Foam, Nickel-Copper Taffeta (NI/CU)
长度0.394" (10.00mm)
形状Round
类型Conductive Foam
宽度0.394" (10.00mm)
工作温度-45°C ~ 85°C
高度0.394" (10.00mm)
安装方法Adhesive
电镀Nickel

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
关闭
Inquiry
captcha

18923764396

点击这里给我发消息
0